Semiconductor light emitting device

ABSTRACT

A semiconductor light emitting device includes a mount section having an insulating property connected to a heat sink, a plurality of semiconductor laser elements disposed on the mount section, and a heat radiation block having an insulating property disposed on the plurality of semiconductor laser elements. A first wiring made of a metal is disposed on an upper surface of the mount section, and a second wiring made of a metal is disposed on a lower surface of the heat radiation block, a part of the second wiring being electrically connected to the first wiring. By electrically connecting the first wiring and the second wiring to each of the plurality of semiconductor laser elements, the plurality of semiconductor laser elements are connected in series, and have a same polarity with each other at a side that each of the plurality of semiconductor laser elements is connected to the first wiring.

RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 16/752,504 filed Jan. 24, 2020, which is a continuation of U.S. patent application Ser. No. 15/986,153, now U.S. Pat. No. 10,581,218, filed on May 22, 2018, which is a continuation of the PCT International Application No. PCT/JP2016/004864 filed on Nov. 11, 2016, which claims the benefit of foreign priority of Japanese patent application No. 2015-239820 filed on Dec. 9, 2015, the contents all of which are incorporated herein by reference.

BACKGROUND 1. Technical Field

The present disclosure relates to a semiconductor light emitting device, and in particular to a semiconductor light emitting device using a high output semiconductor laser, a super luminescent diode, or the like which emit a visible light having wavelength ranging from blue-violet to red.

2. Description of the Related Art

Recently, development of a high output semiconductor laser device as a light source for providing high intensity lighting has been actively performed. For providing a high output from the semiconductor laser device, a structure has been examined that disperses, by using a plurality of semiconductor laser elements, load and heat generation of each of the semiconductor laser elements to improve reliability of the semiconductor laser element. A structure of a semiconductor laser device that simultaneously drives a plurality of semiconductor laser elements disclosed in, for example, Unexamined Japanese Patent Publication No. 9-167878 has been examined.

The structure of the conventional semiconductor light emitting device disclosed in Unexamined Japanese Patent Publication No. 9-167878 will be described with reference to FIG. 19. The conventional semiconductor light emitting device is composed of a plurality of semiconductor laser elements in which n-InP clad layer 6, active layer 7, p-InP clad layer 8, p-InP current block layer 9, n-InP current block layer 10, p⁺-InP cap layer 11 are laminated on semiconductor insulating substrate 5 in this order. The semiconductor laser elements are electrically insulated with each other by element separation grooves 12 each reaching semiconductor insulating substrate 5. In the meanwhile, the semiconductor laser elements, which are electrically insulated, has a structure electrically connecting, by wire 3, n-side electrode 14 provided on n-InP clad layer 6 and p-side electrode 13 provided on p⁺-InP cap layer 11. Thus, a plurality of the semiconductor laser elements are connected in series.

SUMMARY

A semiconductor light emitting device according to the present disclosure includes a mount section having an insulating property connected to a heat sink, a plurality of semiconductor laser elements disposed on the mount section, and a heat radiation block having an insulating property disposed on the plurality of semiconductor laser elements. A first wiring made of a metal is formed on an upper surface of the mount section, and a second wiring made of a metal is formed on a lower surface of the heat radiation block, a part of the second wiring being electrically connected to the first wiring. By electrically connecting the first wiring and the second wiring to each of the plurality of semiconductor laser elements, the plurality of semiconductor laser elements are connected in series, and have a same polarity with each other at a side that each of the plurality of semiconductor laser elements is connected to the first wiring.

According to the semiconductor light emitting device of the present disclosure, the plurality of semiconductor laser elements can be electrically connected in series by using the mount section and the heat radiation block on which the respective metal wirings are formed. Thus, it is possible to avoid concentration of load to one semiconductor laser element, which is remarkable in a nitride semiconductor light emitting element. Additionally, by connecting the plurality of semiconductor laser elements to the mount section at respective sides having the same polarity with each other, an active layer, which generates large heat, can be disposed so as to be closer to a heat sink in each of the plurality of semiconductor laser elements. Thus, heat generated in the plurality of semiconductor laser elements is efficiently dispersed to the heat sink. Therefore, it is possible to suppress temperature increase of the semiconductor laser elements, so that reliability of the semiconductor light emitting device can be improved.

The present disclosure can provide a semiconductor light emitting device having high reliability even in high output operation.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view illustrating a semiconductor light emitting device according to a first exemplary embodiment disposed in a semiconductor package;

FIG. 2 is a perspective front side view illustrating the semiconductor light emitting device according to the first exemplary embodiment;

FIG. 3 is a perspective back side view illustrating the semiconductor light emitting device according to the first exemplary embodiment;

FIG. 4 is a top view illustrating a mount section according to the first exemplary embodiment;

FIG. 5 is a bottom view illustrating a heat radiation block according to the first exemplary embodiment;

FIG. 6 is a front view illustrating a semiconductor laser element according to the first exemplary embodiment;

FIG. 7 is a top view illustrating the semiconductor light emitting device according to the first exemplary embodiment;

FIG. 8 is a cross sectional view taken along line VIII-VIII of FIG. 7;

FIG. 9 is a cross sectional view taken along line IX-IX of FIG. 7;

FIG. 10 is a front view illustrating the semiconductor light emitting device according to the first exemplary embodiment;

FIG. 11 is a front view illustrating a semiconductor light emitting device according to a second exemplary embodiment;

FIG. 12 is a top view illustrating a mount section according to the second exemplary embodiment;

FIG. 13 is a bottom view illustrating a heat radiation block according to the second exemplary embodiment;

FIG. 14 is a front view illustrating a semiconductor light emitting device according to a third exemplary embodiment;

FIG. 15 is a front side perspective view illustrating a semiconductor light emitting device according to a fourth exemplary embodiment;

FIG. 16 is a back side perspective view illustrating the semiconductor light emitting device according to the fourth exemplary embodiment;

FIG. 17 is a top view illustrating a mount section according to the fourth exemplary embodiment;

FIG. 18 is a bottom view illustrating a heat radiation block according to the fourth exemplary embodiment; and

FIG. 19 is a diagram illustrating a structure of a conventional device.

DETAILED DESCRIPTION OF EMBODIMENT

Before describing exemplary embodiments of the present disclosure, problems in a conventional semiconductor light emitting device will be simply described. There is a problem described below when a semiconductor light emitting device of high output and high reliability is provided by using a structure disclosed in Unexamined Japanese Patent Publication No. 9-167878.

First, when insulation between semiconductor laser elements is achieved by an element separation groove as described in Unexamined Japanese Patent Publication No. 9-167878, an insulating substrate needs to be used. Accordingly, for example, in a case of a nitride-based semiconductor laser element having a structure that an n-type semiconductor substrate is used for flowing current to a semiconductor laser element via the n-type semiconductor substrate, it is difficult to produce the same structure as the structure disclosed in Unexamined Japanese Patent Publication No. 9-167878.

Also, since the semiconductor laser elements are connected by a wire, when implementation is performed, a junction up implementation is performed in which a substrate side is joined to a heat sink. Accordingly, an active layer which mostly generates heat is located away from the heat sink, and thus the temperature of each semiconductor laser element disadvantageously increases. As a result, reliability of the semiconductor laser elements decline because of the increase in temperature of the active layer in operation. Furthermore, since the semiconductor laser elements are connected by a wire, a distance between the semiconductor laser elements increases, so that an interval between respective luminous points disadvantageously become wide.

On the other hand, when the semiconductor laser elements are connected in parallel, the inventors of the present disclosure have found a problem described below. By connecting the semiconductor laser elements in parallel, operating current of the semiconductor laser device becomes high. Thus, resistance heating at a joint part of a wire or an electrode increases, so that disconnection of the wire or deterioration of the electrode may disadvantageously occurs.

Furthermore, a p-type semiconductor layer in the nitride-based semiconductor laser element generally has large activation energy, so that its resistance is largely lowered due to increase in carrier density associated with temperature rise. Consequently, in the plurality of semiconductor laser elements connected in parallel, if there is variation or the like in electrode area or contact resistance, unevenness in temperature occurs between the plurality of semiconductor laser elements. When unevenness in temperature once occurs between the plurality of semiconductor laser elements, positive feedback that is (1) increase of current, (2) increase of heat generation, (3) lowering of resistance, and (4) further increase of current, is established in one of the semiconductor laser elements having a high temperature. Therefore, a load to the one semiconductor laser element acceleratively increases.

The present disclosure is conceived to solve the above problem, and provides a semiconductor light emitting device having high reliability also in high output operation.

Hereinafter, semiconductor light emitting devices according to exemplary embodiments of the present disclosure will be described with reference to the drawings.

First Exemplary Embodiment

A structure of a semiconductor light emitting device according to a first exemplary embodiment will be described with reference to FIG. 1 to FIG. 10. FIG. 1 is a perspective view illustrating the semiconductor light emitting device according to the first exemplary embodiment disposed in a semiconductor package. FIG. 2 is a front side perspective view illustrating the semiconductor light emitting device according to the first exemplary embodiment, and FIG. 3 is a back side perspective view illustrating the semiconductor light emitting device according to the first exemplary embodiment. FIG. 4 is a top view illustrating a mount section according to the first exemplary embodiment, and FIG. 5 is a bottom view illustrating a heat radiation block according to the first exemplary embodiment.

As illustrated in FIG. 1, semiconductor light emitting device 120 is installed in semiconductor package 110. Semiconductor package 110 includes base 113 having a substantially circular plate shape, two lead pins 111 passing completely through base 113, and seat 112 projecting from base 113 and having a substantially half cylindrical shape. Semiconductor light emitting device 120 is implemented on seat 112. Lead pin 111 is made of a conductive material such as a metal, and electrically connected to semiconductor light emitting device 120 via a wire or the like, and supplies electric power to semiconductor light emitting device 120 from an outside of semiconductor package 110. Seat 112 is made of a material having high heat conductivity such as a metal, and functions as a heat sink that diffuses heat from semiconductor light emitting device 120 via an implementation surface with semiconductor light emitting device 120.

As illustrated in FIG. 2, FIG. 3, semiconductor light emitting device 120 has a structure in which two semiconductor laser elements (semiconductor laser element 134 a, semiconductor laser element 134 b) are sandwiched by mount section 130 and heat radiation block 140. Mount section 130 includes mount substrate 131 made of, for example, an insulating material such as SiC, AlN, or diamond, and mount wirings formed on an upper surface of mount substrate 131 and, for example, made of a material such as Au, Pt, or Ti (mount wiring 132 a, mount wiring 132 b). Heat radiation block 140 includes heat radiation block substrate 141 made of, for example, an insulating material such as SiC, AlN, or diamond, heat radiation block wirings (heat radiation block wiring 142 a, heat radiation block wiring 142 b described below) formed on a lower surface of heat radiation block substrate 141 and made of, for example, a metal such as Au, Pt, or Ti, and a heat radiation block wiring (heat radiation block wiring 142 c) formed on the upper surface of heat radiation block substrate 141 and made of, for example, a metal such as Au, Pt, or Ti. Herein, a thickness of mount substrate 131 is preferably not less than 50 μm and not more than 500 μm, a width of mount substrate 131 is preferably not less than 500 μm and not more than 2000 μm, and a depth of mount substrate 131 is preferably not less than 500 μm and not more than 4000 μm. Also, a thickness of heat radiation block substrate 141 is preferably not less than 100 μm and not more than 500 μm, a width of heat radiation block substrate 141 is preferably not less than 500 μm and not more than 2000 μm, and a depth of heat radiation block substrate 141 is preferably not less than 500 μm and not more than 4000 μm. A film thickness of each of the mount wirings and the heat radiation block wirings is preferably not less than 50 μm and not more than 300 μm.

Wiring structures on the upper surface of mount section 130 and the lower surface of heat radiation block 140 will be described in detail with reference to FIG. 4, FIG. 5. As illustrated in FIG. 4, by patterning a metal layer formed on a surface (the upper surface) of mount substrate 131, mount wiring 132 a having an L shape and mount wiring 132 b having a rectangular shape are formed. Mount wiring 132 a has an L shape whose width on a front side is small and whose width on a back side is large. Herein, a lower side in the drawing is the front side, and an upper side of the drawing is the back side. Mount solder layer 133 a for joining semiconductor laser element 134 a is formed on the front side of mount wiring 132 a. Also, mount solder layer 133 c for joining conductive post 144 (described below) is formed on the back side of the mount wiring 132 a. Mount solder layer 133 b for joining semiconductor laser element 134 b is formed on mount wiring 132 b. A length in a direction toward the back surface from the front surface of mount wiring 132 b is shorter than mount wiring 132 a having the L shape, and a part of mount wiring 132 a is disposed on mount substrate 131 on the back side of mount wiring 132 b.

Also, as illustrated in FIG. 5, by patterning a metal layer formed on a surface (the lower surface) of heat radiation block substrate 141, heat radiation block wiring 142 a having a rectangular shape and heat radiation block wiring 142 b having an L shape are formed. Heat radiation block wiring 142 b has an L shape whose width on the front side is small and whose width on the back side is large. Herein, the lower side in the drawing is the front side, and the upper side of the drawing is the back side. Heat radiation block solder layer 143 a for joining semiconductor laser element 134 a is formed on heat radiation block wiring 142 a. A length in a direction toward the back surface from the front surface of heat radiation block wiring 142 a is shorter than heat radiation block wiring 142 b having the L shape, and a part of heat radiation block wiring 142 b is disposed on heat radiation block substrate 141 on the back side of heat radiation block wiring 142 a. Heat radiation block solder layer 143 b for joining semiconductor laser element 134 b is formed on the front side of heat radiation block wiring 142 b. Also, conductive post 144 is disposed on the back side of heat radiation block wiring 142 b. Conductive post 144 is fixed to heat radiation block wiring 142 b by plating heat radiation block wiring 142 b.

As illustrated in FIG. 2, semiconductor laser element 134 a and semiconductor laser element 134 b are implemented on mount section 130 with their laser emission end surfaces being oriented toward the front side. Specifically, a lower surface of semiconductor laser element 134 a is electrically connected to and mechanically fixed to mount wiring 132 a by mount solder layer 133 a. Also, a lower surface of semiconductor laser element 134 b is electrically connected to and mechanically fixed to mount wiring 132 b by mount solder layer 133 b.

On the upper surface of mount section 130, semiconductor laser element 134 a and semiconductor laser element 134 b are disposed on the front side, and conductive post 144 is disposed on the back side. As illustrated in FIG. 3, conductive post 144 is electrically connected to and mechanically fixed to mount wiring 132 a extending to the back side by mount solder layer 133 c. Conductive post 144 may be a block made of a metal such as CU or Al, or may be a block made of an insulating material such as AlN or SiC on which a metal is coated.

Heat radiation block 140 is disposed on semiconductor laser element 134 a and semiconductor laser element 134 b, and heat radiation block wiring 142 a and heat radiation block wiring 142 b are respectively joined with semiconductor laser element 134 a and semiconductor laser element 134 b. Specifically, an upper surface of semiconductor laser element 134 a is electrically connected to and mechanically fixed to heat radiation block wiring 142 a by heat radiation block solder layer 143 a. Also, an upper surface of semiconductor laser element 134 b is electrically connected to and mechanically fixed to heat radiation block wiring 142 b by heat radiation block solder layer 143 b.

Also, on the lower surface of heat radiation block 140, semiconductor laser element 134 a and semiconductor laser element 134 b are disposed on the front side, and conductive post 144 is disposed on the back side. Conductive post 144 is electrically connected to and mechanically fixed to heat radiation block wiring 142 b extending to the back side. This makes mount wiring 132 a and heat radiation block wiring 142 b be electrically connected via conductive post 144.

Also, heat radiation block wiring 142 a is electrically connected to heat radiation block wiring 142 c formed on the upper surface of heat radiation block substrate 141 via conductive via 145 (described below) passing completely through heat radiation block substrate 141.

Next, structures of semiconductor laser element 134 a and semiconductor laser element 134 b will be described with reference to FIG. 6. FIG. 6 is a front view of the semiconductor laser element according to the first exemplary embodiment. Herein, semiconductor laser element 134 a will be described as an example.

As illustrated in FIG. 6, semiconductor laser element 134 a includes n-type layer 23 in which n-type clad layer 21 and n-type guide layer 22 are sequentially laminated on n-type semiconductor substrate 20, active layer 24 disposed on n-type layer 23, and p-type layer 28 disposed on active layer 24 in which p-type guide layer 25, p-type clad layer 26, and p-type contact layer 27 are sequentially laminated. Also, a stripe shaped protrusion is formed in p-type clad layer 26, and a p-type contact layer 27 is disposed on the protrusion. A ridge is constituted by the protrusion of p-type clad layer 26 and p-type contact layer 27. An upper surface of p-type clad layer 26 in which no protrusion is formed and side surfaces of the ridge are covered with current block layer 29. An opening is formed in current block layer 29 such that p-type contact layer 27 is exposed, and p-side electrode 30 is in ohmic contact with p-type contact layer 27 at the ridge by being provided with p-side electrode 30 on the opening. Also, n-side electrode 31 is formed on a lower surface of substrate 20. In this way, semiconductor laser element 134 a is energized when a voltage is applied between p-side electrode 30 and n-side electrode 31, so that laser light is emitted. In this context, emission intensity becomes highest in active layer 24 at the lower side of the ridge due to a light confining effect or the like caused by the ridge structure. This portion is referred as a luminous point. The luminous point can be configured so as to be located not only at the center of the semiconductor laser element, but also at a portion shifted on one side by changing the position of the ridge.

When semiconductor laser element 134 a is formed by using a nitride-based semiconductor material, GaN or GaN including Al or In can be used as the above-described semiconductor layer and semiconductor substrate. Note that, in order to yield the light confining effect in the stacking direction of the semiconductor layer, the materials are selected such that a refractive index of active layer 24 becomes higher than a refractive index of n-type layer 23 and a refractive index of p-type layer 28. Specifically, n-type semiconductor substrate 20 is made of GaN. For example, n-type clad layer 21 and n-type guide layer 22 are respectively made of AlGaN and GaN, and their film thicknesses are respectively 3 μm, 100 nm. Also, a composition of Al in AlGaN used in n-type clad layer 21 is about 3%. Active layer 24 has a quantum well structure in which a well layer of InGaN is surrounded by a barrier layer having a bandgap larger than that of the well layer, and can emit light having a desired wavelength by adjusting a composition of In. A thickness of the well layer is preferably not less than 3 nm and not more than 10 nm. P-type guide layer 25 and p-type clad layer 26 are respectively made of GaN and AlGaN, and their film thicknesses are respectively 100 nm, 500 nm. In this context, p-type clad layer 26 may be constituted by a superlattice of AlGaN and GaN. P-type contact layer 27 is made of GaN, and has a p-type dopant concentration higher than that of p-type clad layer 26. Also, a film thickness of p-type contact layer 27 is 5 nm.

In the above-described example, n-type layer 23 is disposed at a side facing the substrate, but p-type layer 28 may be disposed at the side facing the substrate.

Next, the structure of the semiconductor light emitting device according to the first exemplary embodiment will be described in further detail with reference to FIG. 7 to FIG. 10. FIG. 7 is a top view illustrating the semiconductor light emitting device according to the first exemplary embodiment. FIG. 8 is a cross sectional view taken along line VIII-VIII of FIG. 7, and FIG. 9 is a cross sectional view taken along line IX-IX of FIG. 7.

As illustrated in FIG. 7, heat radiation block substrate 141 is smaller than mount substrate 131 in a plan view, and a part of mount wiring 132 a and a part of mount wiring 132 b are not covered with heat radiation block substrate 141. This makes it possible to connect a wire to the part of mount wiring 132 a or the part of mount wiring 132 b exposed from heat radiation block substrate 141 for electrical connection. Furthermore, this makes it possible to connect a wire to heat radiation block wiring 142 c disposed on the upper surface of heat radiation block substrate 141 for electrical connection. Hereinafter, cross sectional structures of semiconductor light emitting device 120 at a part at which semiconductor laser element 134 a is disposed and at a part at which semiconductor laser element 134 b is disposed will be described with reference to FIG. 8, FIG. 9, respectively.

As illustrated in FIG. 8, conductive via 145 is formed in heat radiation block substrate 141 and is disposed on semiconductor laser element 134 a so as to penetrate through heat radiation block substrate 141. Conductive via 145 is constituted by a conductive material such as tungsten or copper which is embedded in a through hole formed in heat radiation block substrate 141. An upper surface of conductive via 145 is electrically connected to heat radiation block wiring 142 c, and a lower surface of conductive via 145 is electrically connected to heat radiation block wiring 142 a. Thus, heat radiation block wiring 142 c and heat radiation block wiring 142 a are electrically connected via conductive via 145. As illustrated in the drawing, heat radiation block wiring 142 c and heat radiation block wiring 142 a may be connected by using a plurality of conductive vias 145.

Heat radiation block wiring 142 a is joined to an electrode at the upper side of semiconductor laser element 134 a via heat radiation block solder layer 143 a. Also, an electrode at the lower side of semiconductor laser element 134 a is joined to mount wiring 132 a via mount solder layer 133 a. Thus, by applying a voltage between mount wiring 132 a and heat radiation block wiring 142 c that is connected to heat radiation block wiring 142 a, current is supplied to semiconductor laser element 134 a, so that it is possible for semiconductor laser element 134 a to emit laser light.

Also, as illustrated in FIG. 9, heat radiation block wiring 142 b that is disposed on semiconductor laser element 134 b and in the lower surface of heat radiation block substrate 141 is joined to an electrode at the upper side of semiconductor laser element 134 b via heat radiation block solder layer 143 b. Furthermore, an electrode at the lower side of semiconductor laser element 134 b is joined to mount wiring 132 b via mount solder layer 133 b. Thus, by applying a voltage between heat radiation block wiring 142 b and mount wiring 132 b, current is supplied to semiconductor laser element 134 b, so that it is possible for semiconductor laser element 134 b to emit laser light.

Furthermore, as illustrated in FIG. 8, FIG. 9, mount wiring 132 a and heat radiation block wiring 142 b are electrically connected via conductive post 144, so that semiconductor laser element 134 a and semiconductor laser element 134 b are connected in series. That is, by applying a voltage between heat radiation block wiring 142 c and mount wiring 132 b, it is possible to supply current to both semiconductor laser element 134 a and semiconductor laser element 134 b.

FIG. 10 is a front view illustrating the semiconductor light emitting device according to the first exemplary embodiment. As illustrated in FIG. 10, both semiconductor laser element 134 a and semiconductor laser element 134 b are joined to mount wiring 132 a and mount wiring 132 b of mount substrate 131, respectively, at a side of p-type layer 28 (junction down type implementation). Herein, each of semiconductor laser element 134 a and semiconductor laser element 134 b has n-type substrate 20 and the semiconductor layer including active layer 24 (n-type layer 23, active layer 24, and p-type layer 28 disposed on n-type substrate 20 in this order) formed on n-type substrate 20 as illustrated in FIG. 6. As described above, semiconductor laser element 134 a is joined with mount wiring 132 a at a side of the semiconductor layer, and semiconductor laser element 134 b is joined with mount wiring 132 b at a side of the semiconductor layer. Therefore, in a case of semiconductor laser element 134 a and semiconductor laser element 134 b using n-type substrate 20, there is not n-type substrate 20 between active layer 24 and p-side electrode 30, so that a distance from active layer 24 to mount substrate 131 is short. Thus, a heat dissipation path for dissipating heat generated in active layer 24 to semiconductor package 110, which is a heatsink, via mount substrate 131 can be short, so that it is possible to suppress temperature increase of semiconductor laser element 134 a and semiconductor laser element 134 b.

Furthermore, in order to make luminous point 139 a of semiconductor laser element 134 a and luminous point 139 b of semiconductor laser element 134 b locate close to each other, positions of the respective ridges are changed to locate close to each other. Thus, the interval between the luminous points can be not more than 100 μm, so that it is possible to improve combining efficiency with an optical system.

As described above, in the semiconductor light emitting device according to the present exemplary embodiment, by applying a voltage between mount wiring 132 b and heat radiation block wiring 142 c, current flows from mount wiring 132 b to heat radiation block wiring 142 c through semiconductor laser element 134 b, heat radiation block wiring 142 b, conductive post 144, mount wiring 132 a, semiconductor laser element 134 a, heat radiation block wiring 142 a, and conductive via 145 in this order. That is, the semiconductor light emitting device of the exemplary embodiment makes it possible to flow current in the two semiconductor light emitting elements (semiconductor light emitting element 134 a and semiconductor light emitting element 134 b) in series as well as dispose the two semiconductor light emitting elements so as to locate the electrodes having the same polarity (P-type) of the respective semiconductor laser elements near the heat sink.

As described above, the problem that a load is concentrated in one semiconductor light emitting device due to connecting a plurality of semiconductor laser elements in parallel can be solved. And thus reliability of the semiconductor light emitting device of high output using a plurality of semiconductor laser elements can be improved.

Furthermore, since the two semiconductor laser elements (semiconductor laser element 134 a, semiconductor laser element 134 b) are also connected to heat radiation block 140, heat can be radiated not only to mount section 130 but also to heat radiation block 140. Furthermore, since the heat transmitted to heat radiation block 140 can be radiated to mount section 130 via conductive post 144, temperature increase of the semiconductor laser elements can be drastically suppressed. Thus, it is possible to improve reliability of the semiconductor light emitting device.

Furthermore, since luminous point 139 a and luminous point 139 b can be disposed in a plane parallel to the implementation surface of semiconductor package 110 and semiconductor light emitting device 120, and the interval between the luminous points can be shortened, it is possible to improve coupling efficiency with the optical system. Therefore, it is possible to secure required light quantity with smaller input power, so that temperature increase of the semiconductor laser elements can be suppressed. Thus, it is possible to improve reliability of the semiconductor light emitting device. As descried above, the semiconductor light emitting device having high reliability even in high-power operation can be provided.

Second Exemplary Embodiment

A structure of a semiconductor light emitting device according to a second exemplary embodiment will be described with reference to FIG. 11 to FIG. 13. FIG. 11 is a front view illustrating the semiconductor light emitting device according to the second exemplary embodiment. FIG. 12 is a top view illustrating a mount section according to the second exemplary embodiment, and FIG. 13 is a bottom view illustrating a heat radiation block according to the second exemplary embodiment. Note that the structure same as that of the first exemplary embodiment will not be described, and a structure different from that of the first exemplary embodiment will be mainly described.

As illustrated in FIG. 11, in semiconductor light emitting device 220 of the present exemplary embodiment, mount groove 251 is provided between mount wiring 232 a and mount wiring 232 b of mount section 230. Furthermore, heat radiation block groove 252 is provided between heat radiation block wiring 242 a and heat radiation block wiring 242 b of heat radiation block 240. Other structure is the same as that of semiconductor light emitting device 120 of the first exemplary embodiment.

As described in FIG. 12, mount groove 251 has a shape bent in an L shape along an outline of mount wiring 232 a having an L shape. In other words, mount groove 251 is entirely formed over a gap between mount wiring 232 a and mount wiring 232 b.

Also, as illustrated in FIG. 13, heat radiation block groove 252 has a shape bent in an L shape along an outline of heat radiation block wiring 242 b having an L shape. In other words, heat radiation block groove 252 is entirely formed over a gap between heat radiation block wiring 242 a and heat radiation block wiring 242 b.

Herewith, in semiconductor light emitting device 220 of the present exemplary embodiment, even when mount solder layer 233 a for joining semiconductor laser element 234 a to mount section 230 is widened to protrude sideways, mount solder layer 233 a is suppressed to be in contact with mount semiconductor layer 232 b by mount groove 251 provided between mount wiring 232 a and mount wiring 232 b. Likewise, mount solder layer 233 b is suppressed to be in contact with mount wiring 232 a by mount groove 251.

Also, even when heat radiation block solder layer 243 a for joining semiconductor laser element 234 a to heat radiation block 240 is widened to protrude sideways, heat radiation block solder layer 243 a is suppressed to be in contact with heat radiation block wiring 242 b by heat radiation block groove 252 provided between heat radiation block wiring 242 a and heat radiation block wiring 242 b. Likewise, heat radiation block solder layer 243 b is suppressed to be in contact with heat radiation block wiring 242 a by heat radiation block groove 252.

As described above, leakage current due to an electrical short circuit between semiconductor laser element 234 a and semiconductor laser element 234 b can be suppressed. Thus, it is possible to improve reliability of the semiconductor light emitting device and yield during manufacture of the semiconductor light emitting device. Other advantageous effects are the same as those of the first exemplified embodiment.

Third Exemplary Embodiment

A structure of a semiconductor light emitting device according to a third exemplary embodiment will be described with reference to FIG. 14. FIG. 14 is a front view illustrating the semiconductor light emitting device according to the third exemplary embodiment. Note that the structure same as that of the first exemplary embodiment will not be described, and a structure different from that of the first exemplary embodiment will be mainly described.

As illustrated in FIG. 14, in semiconductor light emitting device 320 of the present exemplary embodiment, mount protrusion 351 is provided between mount wiring 332 a and mount wiring 332 b of mount section 330. Similar to mount grove 251 in semiconductor light emitting device 220 of the second exemplary embodiment, mount protrusion 351 has a shape bent in an L shape (not shown) along an outline of mount wiring 332 a having an L shape. In other words, mount protrusion 351 is entirely formed over a gap between mount wiring 332 a and mount wiring 332 b.

Furthermore, a height of mount protrusion 351 is set to be substantially equal to a value that is a sum of a height of mount wiring 332 a and a height of mount solder layer 333 a when semiconductor laser element 334 a is implemented on mount section 330, or a sum of a height of mount wiring 332 b and a height of mount solder layer 333 b when semiconductor laser element 334 b is implemented on mount section 330. Also, a width of mount protrusion 351 is larger than a gap between semiconductor laser element 334 a and semiconductor laser element 334 b. And a part of semiconductor laser element 334 a and a part of semiconductor laser element 334 b are placed on mount protrusion 351.

Also, heat radiation block protrusion 352 is provided between heat radiation block wiring 342 a and heat radiation block wiring 342 b of heat radiation block 340. Heat radiation block protrusion 352 has a shape bent in an L shape along an outline of heat radiation block wiring 342 b having an L shape similar to heat radiation block groove 252 in semiconductor light emitting device 220 of the second exemplary embodiment. In other words, heat radiation block protrusion 352 is entirely formed over a gap between heat radiation block wiring 342 a and heat radiation block wiring 342 b.

Furthermore, a height of heat radiation block protrusion 352 is set to be substantially equal to a value that is a sum of a height of heat radiation block wiring 342 a and a height of heat radiation block solder layer 343 a when heat radiation block 340 is implemented on semiconductor laser element 334 a, or a sum of a height of heat radiation block wring 342 b and a height of heat radiation block solder layer 343 b when heat radiation block 340 is implemented on semiconductor laser element 334 b. Also, a width of heat radiation block protrusion 352 is larger than a gap between semiconductor laser element 334 a and semiconductor laser element 334 b. And heat radiation block protrusion 352 is placed on a part of semiconductor laser element 334 a and a part of semiconductor laser element 334 b. Note that other structures are the same as those of semiconductor light emitting device 120 of the first exemplary embodiment.

Herewith, in semiconductor light emitting device 320 of the present exemplary embodiment, even when mount solder layer 333 a for joining semiconductor laser element 334 a to mount section 330 is widened to protrude sideways, mount solder layer 333 a is suppressed to be in contact with mount wiring 332 b by mount protrusion 351 provided between mount wiring 332 a and mount wiring 332 b. Likewise, mount solder layer 333 b is suppressed to be in contact with mount wiring 332 a by mount protrusion 351.

Also, even when heat radiation block solder layer 343 a for joining semiconductor laser element 334 a to heat radiation block 340 is widened to protrude sideways, heat radiation block solder layer 343 a is suppressed to be in contact with heat radiation block wiring 342 b by heat radiation block protrusion 352 provided between heat radiation block wiring 342 a and heat radiation block wiring 342 b. Likewise, heat radiation block solder layer 343 b is suppressed to be in contact with heat radiation block wiring 342 a by heat radiation block protrusion 352.

As described above, leakage current due to an electrical short circuit between semiconductor laser element 234 a and semiconductor laser element 234 b can be suppressed. Thus it is possible to improve reliability of the semiconductor light emitting device and yield during manufacture of the semiconductor light emitting device.

Also, since a part of semiconductor laser element 334 a and a part of semiconductor laser element 334 b are placed on mount protrusion 351, implementation can be performed while keeping a constant distance from a bottom surface of mount section 330 to luminous point 339 a of semiconductor laser element 334 a and luminous point 339 b of semiconductor laser element 334 b. Therefore, it is possible to reduce positional variation of the luminous points with respect to semiconductor package 110, thus it is easy to design an optical system. Other advantageous effects are the same as those of the first exemplified embodiment.

Fourth Exemplary Embodiment

A structure of a semiconductor light emitting device according to a fourth exemplary embodiment will be described with reference to FIG. 15 to FIG. 18. FIG. 15 is a front side perspective view illustrating the semiconductor light emitting device according to the fourth exemplary embodiment, and FIG. 16 is a back side perspective view illustrating the semiconductor light emitting device according to the fourth exemplary embodiment. FIG. 17 is a top view illustrating a mount section according to the fourth exemplary embodiment, and FIG. 18 is a bottom view illustrating a heat radiation block according to the fourth exemplary embodiment. Note that the structure same as that in the first exemplary embodiment will not be described, and a structure different from that of the first exemplary embodiment will be mainly described.

As illustrated in FIG. 15, semiconductor light emitting device 420 according to the present exemplary embodiment has a structure in which three semiconductor laser elements (semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c) are sandwiched between mount section 430 and heat radiation block 440. Mount section 430 has mount substrate 431 and mount wirings (mount wiring 432 a, mount wiring 432 b, and mount wiring 432 c) formed on an upper surface of mount substrate 431. Furthermore, heat radiation block 440 has heat radiation block substrate 441, heat radiation block wirings (heat radiation block wiring 442 a, heat radiation block wiring 442 b, and heat radiation block wiring 442 c to be described below) formed on a lower surface of heat radiation block substrate 441, and a heat radiation block wiring (heat radiation block wiring 442 d) formed on an upper surface of heat radiation block substrate 441. The materials of mount substrate 431, the mount wirings, heat radiation block substrate 441, and the heat radiation block wirings are the same as those in the first exemplary embodiment. Note that other structures are the same as those of semiconductor light emitting device 120 of the first exemplary embodiment.

A wiring structure on upper surface of mount section 430 and lower surface of heat radiation block 440 will be described in detail with reference to FIG. 17 and FIG. 18, respectively. As illustrated in FIG. 17, by patterning a metal layer formed on a surface (upper surface) of mount substrate 431, mount wiring 432 a having an L shape, mount wiring 432 c having a rectangular shape, and mount wiring 432 b located between mount wiring 432 a and mount wiring 432 c are formed. Mount wiring 432 b has an L shape in which a part thereof is cut out. Mount wiring 432 a has an L shape whose width at the front side is small and whose width at the back side is large. Also, mount wiring 432 b has an L shape whose width at the front side is small and whose width at the back side is large, one corner of which is cut out. Herein, the lower side in the drawing is the front side, and the upper side of the drawing is the back side. Mount solder layer 433 a for joining semiconductor laser element 434 a is formed on mount wiring 432 a at the front side. Also, mount solder layer 433 d for joining conductive post 444 a (described below) is formed on mount wiring 432 a at the back side. Mount solder layer 433 b for joining semiconductor laser element 434 b is formed on mount wiring 432 b at the front side. Also, mount solder layer 433 e for joining conductive post 444 b (described below) is formed on mount wiring 432 b at the back side. Mount solder layer 433 c for joining semiconductor laser element 434 c is formed on mount wiring 432 c.

Furthermore, as illustrated in FIG. 18, by patterning a metal layer formed on a surface (lower surface) of heat radiation block substrate 441, heat radiation block wiring 442 a having a rectangular shape, heat radiation block wiring 442 c having an L shape, and heat radiation block wiring 442 b located between heat radiation block wiring 442 a and heat radiation block wiring 442 c are formed. Heat radiation block wiring 442 b has an L shape in which a part thereof is cut out. Heat radiation block wiring 442 c has an L shape whose width at the front side is small and whose width at the back side is large. Also, heat radiation block wiring 442 b has an L whose width at the front side is small and whose width at the back side is large, one corner of which is cut out. Herein, the lower side in the drawing is the front side, and the upper side in the drawing is the back side. Heat radiation block solder layer 443 c for joining semiconductor laser element 434 c is formed on heat radiation block wiring 442 c at the front side. Also, conductive post 444 b is disposed on heat radiation block wiring 442 c at the back side. Heat radiation block solder layer 443 b for joining semiconductor laser element 434 b is formed on heat radiation block wiring 442 b at the front side. Also, conductive post 444 a is disposed on heat radiation block wiring 442 b at the back side. Heat radiation block solder layer 443 a for joining semiconductor laser element 434 a is formed on heat radiation block wiring 442 a.

As illustrated in FIG. 15, semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c are implemented on mount section 430 with their laser emission end surfaces being oriented toward the front side. Specifically, the lower surface of semiconductor laser element 434 a is electrically connected to and mechanically fixed to mount wiring 432 a by mount solder layer 433 a. Also, the lower surface of semiconductor laser element 434 b is electrically connected to and mechanically fixed to mount wiring 432 b by mount solder layer 433 b. Also, the lower surface of semiconductor laser element 434 c is electrically connected to and mechanically fixed to mount wiring 432 c by mount solder layer 433 c.

On the upper surface of mount section 430, semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c are disposed at the front side, and conductive post 444 a and conductive post 444 b are disposed at the back side. As illustrated in FIG. 16, by mount solder layer 433 d, conductive post 444 a is electrically connected to and mechanically fixed to mount wiring 432 a, which is extending to the back side. Also, by mount solder layer 433 e, conductive post 444 b is electrically connected to and mechanically fixed to mount wiring 432 b, which is extending to the back side. The material of conductive post 444 a and conductive post 444 b are the same as that in the first exemplary embodiment.

Heat radiation block 440 is disposed on semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c. And heat radiation block wiring 442 a, heat radiation block wiring 442 b, and heat radiation block wiring 442 c are respectively joined with semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c. Specifically, the upper surface of semiconductor laser element 434 a is electrically connected to and mechanically fixed to heat radiation block wiring 442 a by heat radiation block solder layer 443 a. Also, the upper surface of semiconductor laser element 434 b is electrically connected to and mechanically fixed to heat radiation block wiring 442 b by heat radiation block solder layer 443 b. Also, the upper surface of semiconductor laser element 434 c is electrically connected to and mechanically fixed to heat radiation block wiring 442 c by heat radiation block solder layer 443 c.

On the lower surface of heat radiation block 440, semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c are disposed at the front side, and conductive post 444 a and conductive post 444 b are disposed at the back side. Conductive post 444 a is electrically connected to and mechanically fixed to heat radiation block wiring 442 b, which is extending to the back side. Thus, mount wiring 432 a and heat radiation block wiring 442 b are electrically connected via conductive post 444 a. Also, conductive post 444 b is electrically connected to and mechanically fixed to heat radiation block wiring 442 c, which is extending to the back side. Thus, mount wiring 432 b and heat radiation block wiring 442 c are electrically connected via conductive post 444 b.

Furthermore, heat radiation block wiring 442 a is electrically connected to heat radiation block wiring 442 d formed on the upper surface of heat radiation block substrate 441 via a conductive via (not shown) penetrating through heat radiation block substrate 441. Note that a structure of the conductive via is the same as that in the first exemplary embodiment.

Also, the structure of each of semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c is the same as that in the first exemplary embodiment.

As described above, in semiconductor light emitting device 420 of the exemplary embodiment, it is possible to connect the three semiconductor laser elements (semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c) in series in a state where the electrodes having the same polarity (p-type) of the three semiconductor laser elements are joined to mount section 430 similar to the first exemplary embodiment. That is, by applying a voltage between mount wiring 432 c and heat radiation block wiring 442 d, it is possible to simultaneously emit laser light from the three semiconductor laser elements (semiconductor laser element 434 a, semiconductor laser element 434 b, and semiconductor laser element 434 c). Other advantageous effects are the same as those of the first exemplified embodiment.

As described above, the content of the present disclosure is described using the first to fourth exemplary embodiments, but the present disclosure is not limited to the exemplary embodiments. For example, in the above-described exemplary embodiments, the heat radiation block wirings respectively formed on the upper surface and the lower surface of the heat radiation block substrate are electrically connected to each other by using the conductive via penetrating through the heat radiation block substrate. The heat radiation block wirings on the upper surface and the lower surface, however, may be electrically connected to each other by a conductive film formed on a side surface of the heat radiation block substrate instead of the conductive via.

Furthermore, although the above-described exemplary embodiment illustrates a case where a number of semiconductor laser elements connected in series is two or three, four or more semiconductor laser elements can be connected in series by the same structure.

The present disclosure can be applied to a high output light source or the like used for an industrial lighting device such as a vehicle lighting device, a spot lighting device in a factory or a gym, or a shop lighting device. 

What is claimed is:
 1. A semiconductor laser device comprising: a mount section; a first wiring, a second, and a third wiring connected to an upper surface of the mount section; a first semiconductor laser element having an electrode at an upper side and an electrode at a lower side; and the electrode at the lower side of the first semiconductor laser element is joined to an upper surface of the first wiring; wherein: the first semiconductor laser element has a front side which is a laser emission end surface, a back side opposite to the front side and sides between the front side and the back side, the second wiring includes a first L shape portion in which a part thereof is cut out in plan view, the first L shape portion has a portion opposite to the side of the first semiconductor laser element and a portion opposite to the back side of the first semiconductor laser element, the third wiring includes a second L shape portion in plan view, and the second L shape portion has a portion opposite to a side of first L shape portion.
 2. The semiconductor laser device according to claim 1, wherein the second L shape portion has a portion overlapping the cut out.
 3. The semiconductor laser device according to claim 1, further comprising a second semiconductor laser element having an electrode at an upper side and an electrode at a lower side, wherein the electrode at the lower side of the second semiconductor laser element is joined to an upper surface of the second wiring.
 4. The semiconductor laser device according to claim 3, wherein the first semiconductor laser element and the second semiconductor laser element are connected in series.
 5. The semiconductor laser device according to claim 3, wherein the first semiconductor laser element and the second semiconductor are placed parallel to each other.
 6. The semiconductor laser device according to claim 1, further comprising a third semiconductor laser element having an electrode at an upper side and an electrode at a lower side, wherein the electrode at the lower side of the third semiconductor laser element is joined to an upper surface of the third wiring.
 7. The semiconductor laser device according to claim 6 wherein, the first semiconductor laser element and the third semiconductor laser element are connected in series.
 8. The semiconductor laser device according to claim 6, wherein the first semiconductor laser element and the third semiconductor are placed parallel to each other.
 9. The semiconductor laser device according to claim 1, wherein a width of the second wiring on the back side is larger than a width of the second wiring on the front side along a direction perpendicular to a longitudinal direction of the first semiconductor laser element.
 10. The semiconductor laser device according to claim 1, wherein a width of the third wiring on the back side is larger than a width of the third wiring on the front side along a direction perpendicular to a longitudinal direction of the first semiconductor laser element.
 11. The semiconductor laser device according to claim 1, wherein a first wiring is a rectangular shape in plan view.
 12. The semiconductor laser device according to claim 1, wherein a first wiring and the first semiconductor laser element are joined via a solder layer. 